H907-Y导电银胶 环氧树脂导电胶线路修复 替代焊锡导电胶水低电阻率

H907-Y是一种单组份粘稠性导电银胶；广泛应用在半导体工业、半导体芯片、光电元件、线路元件、电器部件、晶振的导电粘贴，电路板线路修复以及其它各类需导电电子元器件粘接固定；固化物具有优良的导电性、耐热性及高强度粘接性

物性

外观 - 银灰色      粘度 25℃  10000-20000 CPS     

完全固化时间 120℃  60-90min

导热率           W/m.k      2.5            

硬度               shore  D    85-95   

抗拉强度        kg/mm2     4.2            

接着强度        铁---铁     55-85kg/cm2

热线膨胀系数    cm/cm/℃   3.5×10-5/℃    

热变形温度        ℃       130

体积电阻率        Ω- cm       小于1

H907-y is a single component viscous conductive silver adhesive, which is widely used in the semiconductor industry, semiconductor chips, optoelectronic components, circuit components, electrical components, crystal oscillator conductive bonding, circuit board circuit repair and other kinds of conductive electronic components bonding and fixation. The solidified products have excellent conductivity, heat resistance and high strength adhesion

Physical property

Appearance silver grey viscosity 25 ℃ 10000-20000 CPS

Complete curing time 120 ℃ 60-90min

Thermal conductivity w / m.k 2.5

Hardness Shore D 85-95

Tensile strength kg / mm2 4.2

Next strength iron - iron 55-85kg / cm2

Hot wire expansion coefficient cm / cm / ℃ 3.5 × 10-5 / ℃

Thermal deformation temperature ℃ 130

Volume resistivity Ω - cm less than 1

标签：导电电阻率焊锡环氧树脂胶水修复